Bopla Gehäuse Systeme GmbH | Borsigstr. 17-25, 32257 Bünde
Tel.: +49 (0)5223 / 969 - 0 | E-Mail: info@bopla.de | Internet: www.bopla.de
Tel.: +49 (0)5223 / 969 - 0 | E-Mail: info@bopla.de | Internet: www.bopla.de
Interzoll Modul | Card earthing, tin-plated steel, for contacting between board and subrack
KE/M
Order no.: 86022100
Card earthing for circuit board
KE/M
Order no.: 86022100
Card earthing for circuit board
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Product drawing
Enclosure concept
Characteristics
Enclosure Material
Profile Al Mg: Si 0.5; for details see Technical Information
Scope of delivery
20 card earthing units
Important!
To compensate for pressure when temperatures change and cause moisture in the enclosure, we we recommend that you use a
pressure compensation
element.
In order to ensure that you can determine the correct quantity of elements for your application, we are providing you here with a DAE calculator.
Technical documentation / Downloads
3D product data in STEP format:
Login to download
Product drawing in PDF format:
86022100 KE-M.pdf
(43.6 KB)
Product drawing in DXF format:
86022100 KE-M.dxf
(1.4 MB)
- 19 Inch Standard Overview EN.pdf(4.6 MB)
- interzoll-modul en.pdf(6.9 MB)
