EMC coating for plastic enclosures

BOPLA is your competent partner when it is necessary to protect electronics against external interference. We provide three processes which offer you the necessary protection:

•    Copper-chrome-nickel vapour deposition
•    Aluminium vapour deposition
•    Lacquering with conductive copper lacquer
 

With these processes, the surfaces which are not to be – or must not be – coated are covered with tape or masked.
For reasons of time and cost we give preference to lacquering with conductive copper lacquer. However, in your calculations you must take into consideration the disposal and recycling costs specified by the regulations which relate to electronic waste.

Aluminium vapour deposition takes place in high-vacuum plants in accordance with the Elamet® or Nucotec® processes. Aluminium vapour deposition can be recycled without any major expense, and other advantages consist of an even coating thickness and the reproducibility of the coating. We use a coating thickness of at least 2.5 µm as standard. If required, a greater coating thickness is available on request and at any time, depending on the material used for the enclosure.

The mechanical characteristics of the plastic are not altered by the vapour deposition process, so there is no possibility of brittleness or cracking.

Coating masks are now available for most of our standard enclosures, so this screening method can now be offered at very low cost.

We regret that we are unable to accept returns of enclosures which have been coated at customers' specific requests.

Download EMC-Brochure