Bopla Gehäuse Systeme GmbH | Borsigstr. 17-25, 32257 Bünde
Tel.: +49 (0)5223 / 969 - 0 | E-Mail: info@bopla.de | Internet: www.bopla.de
Tel.: +49 (0)5223 / 969 - 0 | E-Mail: info@bopla.de | Internet: www.bopla.de
Intertego | EMC round cord seal, for mounting in front profiles for conductive connections between profiles and plug-in EMC front panels
HF-DI
Order no.: 59010509*
Sold by the metre
HF-DI
Order no.: 59010509*
Sold by the metre
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* = Available on request.
Product drawing
Enclosure concept
Characteristics
Enclosure Material
Profiles: Al Mg Si 0.5; diecast corners: zinc alloy Z410; seal: TPE. For details see Technical Information.
Note
Available on request – mounting takes place in factory.
Important!
To compensate for pressure when temperatures change and cause moisture in the enclosure, we we recommend that you use a
pressure compensation
element.
In order to ensure that you can determine the correct quantity of elements for your application, we are providing you here with a DAE calculator.
