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Intertego | Aluminium bus profiles, natural-coloured anodised, for indirect fixing of backplanes

ITPB 004400
Order no.: 95300044

For IT ..44..

ITPB 002500 Busprofil RED BOOK B 95300025
ITPB 004400
Order no.: 95300044

For IT ..44..

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Product drawing

Enclosure concept

Intertego

Characteristics

HP
80
Enclosure Material

Profiles: Al Mg Si 0.5; diecast corners: zinc alloy Z410; seal: TPE. For details see Technical Information.

Scope of delivery

2 profiles including mounting material (BFS 0400)

Note

Mechanical processing of the side profiles in accordance with the depth of the circuit board is required before the profiles are fitted. EMC cover plates must be cut off in the area of the lateral contact lugs in accordance with the mounting position. Processing and special lengths on request.

Important!

To compensate for pressure when temperatures change and cause moisture in the enclosure, we we recommend that you use a pressure compensation element.

In order to ensure that you can determine the correct quantity of elements for your application, we are providing you here with a DAE calculator.

» Additional information

Technical documentation / Downloads

3D product data in STEP format:
Product drawing in PDF format:
Product drawing in DXF format:

Application examples

  • Intertego Application 10
  • Intertego Application 09
  • Intertego Application 08
  • Intertego Application 07
  • Intertego Application 06
  • Intertego Application 05
  • Intertego Application 04
  • Intertego Application 03
  • Intertego Application 02
  • Intertego Application 01
  • Intertego Application 10
  • Intertego Application 09
  • Intertego Application 08
  • Intertego Application 07
  • Intertego Application 06
  • Intertego Application 05
  • Intertego Application 04
  • Intertego Application 03
  • Intertego Application 02
  • Intertego Application 01

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