Bopla Gehäuse Systeme GmbH | Borsigstr. 17-25, 32257 Bünde
Tel.: +49 (0)5223 / 969 - 0 | E-Mail: info@bopla.de | Internet: www.bopla.de
Tel.: +49 (0)5223 / 969 - 0 | E-Mail: info@bopla.de | Internet: www.bopla.de
Internorm Stil | EMC springs, stainless steel, for the connection between the front panel / backplane and profile
EMV-Feder-FP/M 63TE
Order no.: 86001163
EMV-Feder-FP/M 63TE
Order no.: 86001163
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Product drawing
Enclosure concept
Characteristics
HP
63
Colour of enclosure group
raw (surface untreated)
Enclosure Material
Profiles: Al Mg Si 0.5, anodised. Covers: diecast aluminium. Front handles/flanges: diecast aluminium. Side panels, cover and side plates: passivated aluminium.
Scope of delivery
10 EMC springs
Note
Can be mounted in all front profiles and bus profiles PBIS/M....
Mounting instruction: arrows point outwards.
Important!
To compensate for pressure when temperatures change and cause moisture in the enclosure, we we recommend that you use a
pressure compensation
element.
In order to ensure that you can determine the correct quantity of elements for your application, we are providing you here with a DAE calculator.
Technical documentation / Downloads
3D product data in STEP format:
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Product drawing in PDF format:
86001163 EMV-Feder-FP-M-63TE.pdf
(23.3 KB)
Product drawing in DXF format:
86001163 EMV-Feder-FP-M-63TE.dxf
(197.3 KB)
- 19 Inch Standard Overview EN.pdf(4.6 MB)
- internorm-stil en.pdf(8.5 MB)
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