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Intertego | Snap profiles, natural-coloured anodised aluminium, for holding the card guides
For IT ..45..
For IT ..45..
Product drawing
Enclosure concept
Characteristics
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Profiles: Al Mg Si 0.5; diecast corners: zinc alloy Z410; seal: TPE. For details see Technical Information.
2 profiles including mounting material (BFS 0400)
Mechanical processing of the side profiles in accordance with the depth of the circuit board is required before the profiles are fitted. EMC cover plates must be cut off in the area of the lateral contact lugs in accordance with the mounting position. Processing and special lengths on request.
Important: Suitable pressure compensation element
To compensate for pressure when temperatures change and cause moisture in the enclosure, we we recommend that you use a pressure compensation element.
In order to ensure that you can determine the correct quantity of elements for your application, we are providing you here with a DAE calculator.
Technical documentation / Downloads
- 19 Inch Standard Overview EN.pdf (4.6 MB)
- intertego en.pdf (2.8 MB)
