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Fused Deposition Modeling (FDM)

If you want to have prototypes or single pieces made out of plastic for your individual enclosure, one popular method of manufacturing is 3D printing in the form of Fused Deposit Modelling. BOPLA uses this additive process to create test pieces to ensure compatibility with the customer’s electronics and function samples of newly-developed enclosures.

In the Fused Deposition Modelling process, a workpiece - for example an enclosure - including supporting geometry, is built up in layers from a thermoplastic plastic thread. This process, one of the standard procedures of rapid prototyping, is based on the liquefaction by heating of a wire-shaped plastic or wax material. As the material cools, it solidifies again. Material deposition takes place by means of extrusion using freely-movable heating nozzles on the manufacturing level. The layer thickness is about 0.25 mm, with a wall thickness of at least 1 mm. When a model is built up in individual layers, they combine to make a complex part. By using this process, protruding components can be manufactured with the use of supporting material. This means that your prototype can be delivered as quickly as 4 to 10 days after receipt of your order and provision of the data.


FDM offers these advantages:

  • A low-cost process
  • It stands out most because of its speed. By using FDM, enclosure prototypes can be produced much more quickly than with other processes.


Note the following characteristics:

  • The finished prototypes are less suitable if intended for presentation and display purposes. However, they give the customer an initial impression of the new enclosure at an early stage of the project and also indicate where changes and improvements may need to be carried out.
  • A rough surface is to be expected, and also a lack of stability in the case of filigree components and a low level of precision.


You need to provide us with the following:

  • In order to be able to manufacture the samples which you require, we need only the 3D data of the relevant enclosure or component.