Bünde, March 30th, 2023 – Only the dimensions are standardised: At the same time as the launch of the product catalogue, Bopla Gehäuse Systeme GmbH are restructuring their range of 19” products. Now the customer-specific assembly systems are divided into subrack and desktop enclosures, small control enclosures for the fitting of 19” subracks and front panels. In addition, BOPLA manufactures non-standard enclosures for PCBs. The ideal solution when developers require a package of services from planning to sampling to series manufacture to packaging – and all available from a single source. This ensures that BOPLA is meeting increased demands and expectations from the market.
A specially-printed front panel. A desktop enclosure which can also be integrated in a cabinet. A 19” enclosure for a special size of PCB which doesn’t conform to the Euro card format. And, not least, customer-specific packaging. The demands made of 19” subracks and other assembly systems are increasing. It’s not just the sturdy outer case which is important – increasingly, customer-specific equipment details are an integral part of development. A competent partner for subracks is more important than ever:
“Using the standardised 19” system as a basis, we manufacture the individual systems that our customers ask for. In addition to the wide range of products, our huge depth of production allows us to produce a unique total package from a single source.”
-Olaf Kleineberg, BOPLA’s product manager for 19” subracks
Always in accordance with DIN EN 60297-3-101
Developers can choose between BOPLA’s metal and plastic applications for the 19”-compliant enclosures used for their electronics systems. All the components are standardised in accordance with DIN EN 60297-3-101. The different designs and sizes and a wide range of accessories provide a high degree of flexibility for different applications. In doing this, the range of products makes both standard andEMC versions available. BOPLA assembles various standard components as required and by using a modular concept. The result is a customer-specific subrack or 19”-standard system enclosure.
The customisable front panels for Euro cards can be supplied with additional features such as an ejector handle or extended by means of a protective unit. BOPLA’s three subrack variants satisfy customer-specific requirements, including with regard to EMC protection. The Interzoll subrack is designed for use with basic applications, and the Interzoll Modul components are ideal for complex and EMC-screened applications. Interzoll Plus was originally designed as a 19” desktop enclosure, but thanks to its standardised dimensions it can also be integrated in confined spaces. The Interzoll Case special enclosure with its standard width of 19” gives developers more space for horizontal PCBs with a low assembly height.
Internorm Stil is a desktop enclosure as a stand-alone solution with integrated earth conductor connections, good electromagnetic screening and optional ventilation. With regard to design and flexibility, the Intertego range goes a step further: on the one hand, it can be integrated as a stand-alone version or mountable subrack in different environments.
On the other hand, the metal enclosures are available in three heights, three widths and three depths and also as an individual design. In addition, the Internorm plastic assembly system, which is still one of the few plastic small cabinet enclosures available worldwide, provides a cost-effective alternative to large subrack cabinets with a protection class up to IP54. A maximum of twelve standard subracks can be integrated.
HMI systems and membrane keypads can be integrated
BOPLA is adding to the total package in the 19” enclosure sector by means of comprehensive services along the process chain. The enclosure specialists support their customers as early as the planning phase. By making use of different manufacturing methods, the company is able to meet all the requirements from one source. Even special features such as HMI systems or membrane keypads can be integrated in the 19” enclosures. In addition, BOPLA individualises the modules by means of laser marking and silk screen or digital printing. Assembly of the subracks and individual packaging are part of the total package.
There is a worldwide demand for all of this, and thanks to the Phoenix Mecano Group’s global network, it is the customers who benefit. Within the framework of standardised dimensions, the modules and assembly systems are used in various sectors such as control and instrumentation applications, in bus and automotive systems, for infrastructure projects or in the telecommunications sector. The BN variants of the subracks were tested for vibration resistance in accordance with test standard BN 411 002. This ensures that they are especially suitable for use in rail transportation.